Venite a visitarci al
Hall 4.2, Stand C61
 
 
Smallest RTC 3.2 x 1.5 x 0.8
0C to +50C 0.13 s/day 1.5 ppm
-40°C to +85°C ± 0.26 s/day ± 3.0 ppm
CERAMIC Heat Sink
It dissipates 30% quicker than
conventional aluminum/copper solutions
 
• Excellent thermal dissipation
• High Insulation
• Low thermal expansion
• Slim and lightweight
Power consumption : only 240nA
BUS : I2C
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