Metal Core Inductors

PANEL TYPE
AUTOMOTIVE AEC-Q200

Oper. temp. -55/+125°C

PANEL TYPE
AUTOMOTIVE AEC-Q200

Oper. temp. -55/+125°C

Introduction
Metal Power Inductors are based on a new and innovating core technology , with higher performance and reliability compared to ferrite core inductors. Cores are based onto Metal Alloys, such like : FeSi, FeSiCr, FeNi, FeSiB, FeSiCrB, etc, and are characterizede by higher saturation currents. Moreover innovating Panel packaging Process has several advatantages respect to solutions based on thin film, Press Molding, Wire Winding and Multi-layer in terms of smaller size, high current, cost-saving process

Introduction
Metal Power Inductors are based on a new and innovating core technology , with higher performance and reliability compared to ferrite core inductors. Cores are based onto Metal Alloys, such like : FeSi, FeSiCr, FeNi, FeSiB, FeSiCrB, etc, and are characterizede by higher saturation currents. Moreover innovating Panel packaging Process has several advatantages respect to solutions based on thin film, Press Molding, Wire Winding and Multi-layer in terms of smaller size, high current, cost-saving process

Core competency
• Top and Bottom surface : Cover layer

• Excellent Anti- Corrosion
• Metal Magnetic body : Fe Alloy

• High Permeability & Efficiency
• Cu wire : 70mm – 380mm

• Wide Inductance Range & Low DCR
• Terminal (Cu/Ni/Sn) : Cu Plating

• Low resistance & high Cohesive strength

Features
• High Current & Low DCR

• High Efficiency
• Miniaturization
• Stable Yield for SMT Process
• Shape Flexibility for Terminal Pad
• Frequency range up to 10MHz
• Lowest ratio DCR/uH
• Buzz noise suppression

Core competency
• Top and Bottom surface : Cover layer

• Excellent Anti- Corrosion
• Metal Magnetic body : Fe Alloy

• High Permeability & Efficiency
• Cu wire : 70mm – 380mm

• Wide Inductance Range & Low DCR
• Terminal (Cu/Ni/Sn) : Cu Plating

• Low resistance & high Cohesive strength

Features
• High Current & Low DCR

• High Efficiency
• Miniaturization
• Stable Yield for SMT Process
• Shape Flexibility for Terminal Pad
• Frequency range up to 10MHz
• Lowest ratio DCR/uH
• Buzz noise suppression

Comparison of panel type respect to other packaging processes
Type Multi-layer Wire Winding Press molding Thin film Panel type
Merit Small & low profile
Cost saving preocess
High inductance
Cost saving process
High current Small & low profile High inductance
high current
Small & low profile
Cost saving process
De-merit Low current Low current
Height limit
Height limit High priced Process
Comparison of panel type respect to other packaging processes
Panel Type Merit : High inductance, high current, small & low profile, cost saving process
De-merit : –
Multi-layer Merit : Small & low profile
Cost saving preocess
De-merit : Low current
Wire Wounding Merit : High inductance
Cost saving process
De-merit : Low curretn, Height limit
Press molding Merit : High current
De-merit : height limit
Thin film Merit : Small & low profile
De-merit : High priced process

IMPACT RESISTANCE

HEAT RESISTANCE

MOISTURE PROOF

CORROSION RESISTANCE

Products range
Type Size Values
WPI252010 2520 (H1.0) 0.47 / 10mH
WPI252012 2520 (H1.2) 0.47 / 10mH
WPI302808 3028 (H0.8) 0.33 / 10mH
WPI302810 3028 (H1.0) 0.33 / 10mH
WPI403808 4038 (H0.8) 0.22 / 10mH
WPI403810 4038 (H1.0) 0.22 / 10mH
WPI454312 4543 (H1.2) 0.47 / 22mH
WPI454315 4543 (H1.5) 0.47 / 22mH
WPI454318 4543 (H1.8) 0.47 / 22mH
WPI454320 4543 (H2.0) 0.47 / 22mH
WPI545120 5451 (H2.0) 0.33 / 22mH
WPI696530 6965 (H3.0) 0.47 / 22mH
Products range
Type Size Values
WPI252010 2520 (H1.0) 0.47 / 10mH
WPI252012 2520 (H1.2) 0.47 / 10mH
WPI302808 3028 (H0.8) 0.33 / 10mH
WPI302810 3028 (H1.0) 0.33 / 10mH
WPI403808 4038 (H0.8) 0.22 / 10mH
WPI403810 4038 (H1.0) 0.22 / 10mH
WPI454312 4543 (H1.2) 0.47 / 22mH
WPI454315 4543 (H1.5) 0.47 / 22mH
WPI454318 4543 (H1.8) 0.47 / 22mH
WPI454320 4543 (H2.0) 0.47 / 22mH
WPI545120 5451 (H2.0) 0.33 / 22mH
WPI696530 6965 (H3.0) 0.47 / 22mH